Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish /

Project Paper (Sarjana Muda Kejuruteraan Mekanikal) - Universiti Teknologi Malaysia, 2006

Bibliographic Details
Main Author:	397935 Koh, Joyce Swee Fong
Format:
Language:	eng
Published:	Skudai : Universiti Teknologi Malaysia, 2006
Subjects:	Solder and soldering Intermetallic compounds
Online Access:	http://www.psz.utm.my/sla/billing/login.asp?mid=54813

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