Silicon wafer bonding technology : for VLSI and MEMS applications /
16
Autors principals: | , |
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Format: | |
Idioma: | eng |
Publicat: |
London : INSPEC,
2002
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Matèries: |
16
Autors principals: | , |
---|---|
Format: | |
Idioma: | eng |
Publicat: |
London : INSPEC,
2002
|
Matèries: |