Thermal analysis of flip chip ball grid array (FCBGA) electronics package using finite element method /

Slični predmeti

• Thermal analysis of flip chip ball grid array (FCBGA) electronics package using finite element method [electronic resource] /
  od: Nor Haizully Azizan, 1985-
  Izdano: (2008)
• Advanced flip chip packaging /
  od: Tong, Ho-ming Herbert, 1954-, i dr.
  Izdano: (2013)
• Effect of flip-chip ball grid array structure on capillary underfill flow
  od: Hao-Hsi Hung, i dr.
  Izdano: (2024-09-01)
• Area array packaging handbook /
  od: 193092 Gilleo, Ken
  Izdano: (2002)
• Area array packaging materials : adhesives, pastes, and lead-free /
  od: Gilleo, Ken
  Izdano: (2004)