Area array packaging processes : for BGA, Flip Chip, and CSP /

Area array packaging processes : for BGA, Flip Chip, and CSP /

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Bibliographic Details
Main Author: Gilleo, Ken
Format:
Language:eng
Published: New York, N.Y. : McGraw-Hill, 2004
Subjects:
Microelectronic packaging
Multichip modules (Microelectronics)

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