Area array packaging processes : for BGA, Flip Chip, and CSP /

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Bibliographic Details
Main Author: Gilleo, Ken
Format:
Language:eng
Published: New York, N.Y. : McGraw-Hill, 2004
Subjects:
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author Gilleo, Ken
author_facet Gilleo, Ken
author_sort Gilleo, Ken
collection OCEAN
description 16
first_indexed 2024-03-05T02:18:24Z
format
id KOHA-OAI-TEST:276360
institution Universiti Teknologi Malaysia - OCEAN
language eng
last_indexed 2024-03-05T02:18:24Z
publishDate 2004
publisher New York, N.Y. : McGraw-Hill,
record_format dspace
spelling KOHA-OAI-TEST:2763602020-12-19T17:08:55ZArea array packaging processes : for BGA, Flip Chip, and CSP / Gilleo, Ken New York, N.Y. : McGraw-Hill,2004eng16PSZJBLMicroelectronic packagingMultichip modules (Microelectronics)URN:ISBN:0071428291 (hbk.)
spellingShingle Microelectronic packaging
Multichip modules (Microelectronics)
Gilleo, Ken
Area array packaging processes : for BGA, Flip Chip, and CSP /
title Area array packaging processes : for BGA, Flip Chip, and CSP /
title_full Area array packaging processes : for BGA, Flip Chip, and CSP /
title_fullStr Area array packaging processes : for BGA, Flip Chip, and CSP /
title_full_unstemmed Area array packaging processes : for BGA, Flip Chip, and CSP /
title_short Area array packaging processes : for BGA, Flip Chip, and CSP /
title_sort area array packaging processes for bga flip chip and csp
topic Microelectronic packaging
Multichip modules (Microelectronics)
work_keys_str_mv AT gilleoken areaarraypackagingprocessesforbgaflipchipandcsp