Area array packaging processes : for BGA, Flip Chip, and CSP /
16
Main Author: | |
---|---|
Format: | |
Language: | eng |
Published: |
New York, N.Y. : McGraw-Hill,
2004
|
Subjects: |
_version_ | 1826411663531704320 |
---|---|
author | Gilleo, Ken |
author_facet | Gilleo, Ken |
author_sort | Gilleo, Ken |
collection | OCEAN |
description | 16 |
first_indexed | 2024-03-05T02:18:24Z |
format | |
id | KOHA-OAI-TEST:276360 |
institution | Universiti Teknologi Malaysia - OCEAN |
language | eng |
last_indexed | 2024-03-05T02:18:24Z |
publishDate | 2004 |
publisher | New York, N.Y. : McGraw-Hill, |
record_format | dspace |
spelling | KOHA-OAI-TEST:2763602020-12-19T17:08:55ZArea array packaging processes : for BGA, Flip Chip, and CSP / Gilleo, Ken New York, N.Y. : McGraw-Hill,2004eng16PSZJBLMicroelectronic packagingMultichip modules (Microelectronics)URN:ISBN:0071428291 (hbk.) |
spellingShingle | Microelectronic packaging Multichip modules (Microelectronics) Gilleo, Ken Area array packaging processes : for BGA, Flip Chip, and CSP / |
title | Area array packaging processes : for BGA, Flip Chip, and CSP / |
title_full | Area array packaging processes : for BGA, Flip Chip, and CSP / |
title_fullStr | Area array packaging processes : for BGA, Flip Chip, and CSP / |
title_full_unstemmed | Area array packaging processes : for BGA, Flip Chip, and CSP / |
title_short | Area array packaging processes : for BGA, Flip Chip, and CSP / |
title_sort | area array packaging processes for bga flip chip and csp |
topic | Microelectronic packaging Multichip modules (Microelectronics) |
work_keys_str_mv | AT gilleoken areaarraypackagingprocessesforbgaflipchipandcsp |