Area array packaging processes : for BGA, Flip Chip, and CSP /
16
| Autor principal: | |
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| Format: | |
| Idioma: | eng |
| Publicat: |
New York, N.Y. : McGraw-Hill,
2004
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| Matèries: |
| _version_ | 1826411663531704320 |
|---|---|
| author | Gilleo, Ken |
| author_facet | Gilleo, Ken |
| author_sort | Gilleo, Ken |
| collection | OCEAN |
| description | 16 |
| first_indexed | 2024-03-05T02:18:24Z |
| format | |
| id | KOHA-OAI-TEST:276360 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T02:18:24Z |
| publishDate | 2004 |
| publisher | New York, N.Y. : McGraw-Hill, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:2763602020-12-19T17:08:55ZArea array packaging processes : for BGA, Flip Chip, and CSP / Gilleo, Ken New York, N.Y. : McGraw-Hill,2004eng16PSZJBLMicroelectronic packagingMultichip modules (Microelectronics)URN:ISBN:0071428291 (hbk.) |
| spellingShingle | Microelectronic packaging Multichip modules (Microelectronics) Gilleo, Ken Area array packaging processes : for BGA, Flip Chip, and CSP / |
| title | Area array packaging processes : for BGA, Flip Chip, and CSP / |
| title_full | Area array packaging processes : for BGA, Flip Chip, and CSP / |
| title_fullStr | Area array packaging processes : for BGA, Flip Chip, and CSP / |
| title_full_unstemmed | Area array packaging processes : for BGA, Flip Chip, and CSP / |
| title_short | Area array packaging processes : for BGA, Flip Chip, and CSP / |
| title_sort | area array packaging processes for bga flip chip and csp |
| topic | Microelectronic packaging Multichip modules (Microelectronics) |
| work_keys_str_mv | AT gilleoken areaarraypackagingprocessesforbgaflipchipandcsp |