Area array packaging processes : for BGA, Flip Chip, and CSP /

Area array packaging processes : for BGA, Flip Chip, and CSP /

16

书目详细资料
主要作者:	Gilleo, Ken
格式:
语言:	eng
出版:	New York, N.Y. : McGraw-Hill, 2004
主题:	Microelectronic packaging Multichip modules (Microelectronics)

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