Intermetallic compound (IMC) formation in lead free soldering on immersion silver finish /

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal-Bahan)) - Universiti Teknologi Malaysia, 2009

Bibliographic Details
Main Authors:	Chua, Chai Ying, 1985-, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal
Format:
Language:	eng
Published:	2009
Subjects:	Intermetallic compounds Solder and soldering

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