Effect of temperature on delamination in IC package SIS 5595 /

Project Paper (Sarjana Muda Sains Industri (Fizik Bahan)) - Universiti Teknologi Malaysia, 2009

Bibliographic Details
Main Authors:	438050 Liew, Wei Hou, Mohd. Khairi Saidin, supervisor, Fakulti Sains
Format:
Language:	eng
Published:	2009

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