Role of tin content in the wetting of Cu and Au by tin-bismuth solders /

Role of tin content in the wetting of Cu and Au by tin-bismuth solders /

16

Bibliographic Details
Main Authors: 378472 Powers, Tamar A., Singler, T. J., Clum, J. A.
Format:
Language:eng
Subjects:
Tin
Solder and soldering
Metallizing

Similar Items