Role of tin content in the wetting of Cu and Au by tin-bismuth solders /

Ítems similars

• Tin whisker formation and intermetallic compound between tin - silver - copper solders and immersion tin finish /
  per: Azizah Wahi, 1984-, et al.
  Publicat: (2009)
• Tin whisker formation and intermetallic compound between tin - silver - copper solders and immersion tin finish [electronic resource] /
  per: Azizah Wahi, 1984-, et al.
  Publicat: (2009)
• Soft solder
  per: 982 SIRIM
• Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish /
  per: Koid, Chun Ping, 1987-, et al.
  Publicat: (2011)
• Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish /
  per: 399565 Tai, Siew Fong
  Publicat: (2003)