Study on the intermetallics formed at the interface between lead free solders and electroless nickel/immersion gold (ENIG) surface finish /

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2005

Bibliographic Details
Main Author:	285992 Yeap, Kong Boon
Format:
Language:	eng
Published:	Skudai : Universiti Teknologi Malaysia, 2005
Subjects:	Nickel-plating Intermetallic compounds
Online Access:	http://www.psz.utm.my/sla/billing/login.asp?mid=54065

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