Quality improvement of solder paste printing process using six sigma methodology /

Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Industri)) - Universiti Teknologi Malaysia, 2005

Bibliographic Details
Main Author:	289882 Wong, Jing Hao
Format:
Language:	eng
Published:	Skudai : Universiti Teknologi Malaysia, 2005
Subjects:	Production management Process control Solder pastes Surface mount technology
Online Access:	http://www.psz.utm.my/sla/billing/login.asp?mid=54814

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