Quality improvement of solder paste printing process using six sigma methodology /
Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Industri)) - Universiti Teknologi Malaysia, 2005
| প্রধান লেখক: | |
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| বিন্যাস: | |
| ভাষা: | eng |
| প্রকাশিত: |
Skudai : Universiti Teknologi Malaysia,
2005
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| বিষয়গুলি: | |
| অনলাইন ব্যবহার করুন: | http://www.psz.utm.my/sla/billing/login.asp?mid=54814 |
| _version_ | 1826431632526016512 |
|---|---|
| author | 289882 Wong, Jing Hao |
| author_facet | 289882 Wong, Jing Hao |
| author_sort | 289882 Wong, Jing Hao |
| collection | OCEAN |
| description | Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Industri)) - Universiti Teknologi Malaysia, 2005 |
| first_indexed | 2024-03-05T07:18:39Z |
| format | |
| id | KOHA-OAI-TEST:376291 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T07:18:39Z |
| publishDate | 2005 |
| publisher | Skudai : Universiti Teknologi Malaysia, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:3762912020-12-19T17:13:06ZQuality improvement of solder paste printing process using six sigma methodology / 289882 Wong, Jing Hao Skudai : Universiti Teknologi Malaysia,2005engProject Paper (Sarjana Muda Kejuruteraan Mekanikal (Industri)) - Universiti Teknologi Malaysia, 2005Negative microfilm : MFL 13757 ra22PRZSLProduction managementProcess controlSolder pastesSurface mount technologyhttp://www.psz.utm.my/sla/billing/login.asp?mid=54814 |
| spellingShingle | Production management Process control Solder pastes Surface mount technology 289882 Wong, Jing Hao Quality improvement of solder paste printing process using six sigma methodology / |
| title | Quality improvement of solder paste printing process using six sigma methodology / |
| title_full | Quality improvement of solder paste printing process using six sigma methodology / |
| title_fullStr | Quality improvement of solder paste printing process using six sigma methodology / |
| title_full_unstemmed | Quality improvement of solder paste printing process using six sigma methodology / |
| title_short | Quality improvement of solder paste printing process using six sigma methodology / |
| title_sort | quality improvement of solder paste printing process using six sigma methodology |
| topic | Production management Process control Solder pastes Surface mount technology |
| url | http://www.psz.utm.my/sla/billing/login.asp?mid=54814 |
| work_keys_str_mv | AT 289882wongjinghao qualityimprovementofsolderpasteprintingprocessusingsixsigmamethodology |