Quality improvement of solder paste printing process using six sigma methodology /

Quality improvement of solder paste printing process using six sigma methodology /

Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Industri)) - Universiti Teknologi Malaysia, 2005

Bibliographic Details
Main Author:	289882 Wong, Jing Hao
Format:
Language:	eng
Published:	Skudai : Universiti Teknologi Malaysia, 2005
Subjects:	Production management Process control Solder pastes Surface mount technology
Online Access:	http://www.psz.utm.my/sla/billing/login.asp?mid=54814

Similar Items

Quality improvement of solder paste printing process using six sigma methodology [compact disc] /
by: 289882 Wong, Jing Hao
Published: (2005)

Soldering handbook for printed circuits and surface mounting /
by: Manko, Howard H
Published: (1995)

Solder paste in electronics packaging : technology and applications in surface mount, hybrid, circuits, and component assembly /
by: 342034 Hwang, Jennie S.
Published: (1992)

Solder paste in electronics packaging : technology and applications in surface mount, hybrid circuits, and component assembly /
by: 342034 Hwang, Jennie S.
Published: (1989)

Solder paste process control /
by: 438819 Clark, David J.

On-line estimation of power law fluid parameters for solder paste printing control /
by: 192339 Braunstein, Daniel, et al.

Towards defect free SMT reflow soldering process /
by: 181409 Yow, Huoy Thyng
Published: (2002)

Failure analysis of solder joint on fine pitch devices /
by: 266816 Isaac Selvaraj Peter
Published: (1999)

Soldering of Passive Components Using Sn Nanoparticle Reinforced Solder Paste: Influence on Microstructure and Joint Strength
by: Anas M. Atieh, et al.
Published: (2019-10-01)

Evolution of internal states in a Sn-Pb solder joint during Re-flow and thermal cycles /
by: 209274 Liew, Yek Ban, et al.
Published: (2004)

Solder joint fatigue life model/
by: 516985 Darveaux, Robert

Design and Experiment of a Solder Paste Jetting System Driven by a Piezoelectric Stack
by: Shoudong Gu, et al.
Published: (2016-06-01)

Understanding the Effect of Reflow Profile on the Metallurgical Properties of Tin–Bismuth Solders
by: Karel Dušek, et al.
Published: (2022-01-01)

Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process
by: Muhammad Iqbal Ahmad, et al.
Published: (2021-07-01)

Lead-free soldering /
by: Bath, Jasbir Singh
Published: (2007)

Handbook of machine soldering : a guide for the soldering of electronic printed wiring assemblies/
by: 324091 Woodgate, Ralph W.
Published: (1983)

Optimization of the soldering process by the DMAIC methodology
by: Michał Zasadzień
Published: (2016-06-01)

Soldering /
by: 247850 Thwaites, C. J., et al.
Published: (1975)

How to prevent soldering defect in wave soldering process /
by: 439621 Lok, Chee Han
Published: (2002)

Interfacial reactions during soldering between lead-free solders and immersion silver surface finish /
by: Tyah, Jun Hao, 1985-, et al.
Published: (2009)

Soldering manual
by: 8940 American Welding Society
Published: (1959)

Soldering manual /
by: 8940 American Welding Society
Published: (1978)

Interfacial reactions during soldering between lead-free solders and immersion silver surface finish [electronic resource] /
by: Tyah, Jun Hao, 1985-
Published: (2009)

Soldering handbook : a practical guide to process and quality control /
by: 374054 Skipp, Ray
Published: (1988)

Heat Transfer Modeling and Oven Temperature Curve Optimization of Integrated Circuit Board Reflow Soldering
by: Geng Ma, et al.
Published: (2021-01-01)

Soldering : understanding the basics /
by: Schwartz, Mel, editor
Published: (2014)

Soft soldering [kasetvideo]
Published: ([19-)

Soft soldering [filem]
Published: ([19-)

ABC's of electrical soldering/
by: 330363 Dezettel, Louis M.
Published: (1968)

Interfacial reactions during soldering of lead-free solders on copper and nickel substrates /
by: Siti Rabiatull Aisha Idris, 1983-, et al.
Published: (2012)

Methodology for hyvbrid experimental numerical determination of solder/intermetallic interface shear strength [electronic resource] /
by: Low, Kok Wai, 1984-
Published: (2007)

Methodology for hybrid experimental-numerical determination of solder/intermetallic interface shear strength /
by: Low, Kok Wai, 1984-, et al.
Published: (2007)

Soldering and brazing /
by: 212418 Cain, Tubal
Published: (1985)

Principles of soldering /
by: 454840 Humpston, Giles, et al.
Published: (2004)

Soldering in Electronics /
by: Wassink, R. J. Klein, author 655336
Published: (1984)

Soldering : module 04208-02
Published: (2002)

Basic soldering for electronics [kasetvideo]
Published: ([19-)

Theory and practice of soldering [kasetvideo]
Published: ([19-)

Theory and practice of soldering [filem]
Published: ([19-)

Soft solders for automobile use
by: 8096 British Standards Institution