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Intermetallics formation durin...
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Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish [electronic resource] /
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007
Bibliographic Details
Main Author:
458317 Liew, Chung Wah
Format:
Published:
2007
Subjects:
Intermetallic compounds
Solder and soldering
Holdings
Description
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