Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish [electronic resource] /

Eitemau Tebyg

• Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish /
  gan: 458317 Liew, Chung Wah, et al.
  Cyhoeddwyd: (2007)
• The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish /
  gan: 200265 Moey, Chin Boon
  Cyhoeddwyd: (2005)
• Intermetallic compound (IMC) formation in lead free soldering on immersion silver finish /
  gan: Chua, Chai Ying, 1985-, et al.
  Cyhoeddwyd: (2009)
• Effect of multiple reflow and solder bump size solder on intermetallic compound formation between Sn-4Ag-0.5Cu and enig surface finish /
  gan: 288113 Siti Rabiatull Aisha Idris, et al.
  Cyhoeddwyd: (2006)
• The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [microfilm] /
  gan: Moey, Chin Boon
  Cyhoeddwyd: (2006)