Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish [electronic resource] /
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007
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2007
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| _version_ | 1826438519112859648 |
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| author | 458317 Liew, Chung Wah |
| author_facet | 458317 Liew, Chung Wah |
| author_sort | 458317 Liew, Chung Wah |
| collection | OCEAN |
| description | Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007 |
| first_indexed | 2024-03-05T09:01:30Z |
| format | |
| id | KOHA-OAI-TEST:410623 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| last_indexed | 2024-03-05T09:01:30Z |
| publishDate | 2007 |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:4106232020-12-19T17:14:20ZIntermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish [electronic resource] / 458317 Liew, Chung Wah 2007Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007Includes bibliographical referencesPSZJBLIntermetallic compoundsSolder and soldering |
| spellingShingle | Intermetallic compounds Solder and soldering 458317 Liew, Chung Wah Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish [electronic resource] / |
| title | Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish [electronic resource] / |
| title_full | Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish [electronic resource] / |
| title_fullStr | Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish [electronic resource] / |
| title_full_unstemmed | Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish [electronic resource] / |
| title_short | Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish [electronic resource] / |
| title_sort | intermetallics formation during soldering between sn 4ag 0 5cu solder and immersion silver finish electronic resource |
| topic | Intermetallic compounds Solder and soldering |
| work_keys_str_mv | AT 458317liewchungwah intermetallicsformationduringsolderingbetweensn4ag05cusolderandimmersionsilverfinishelectronicresource |