Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish [electronic resource] /

Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish [electronic resource] /

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007

Bibliographic Details
Main Author:	458317 Liew, Chung Wah
Format:
Published:	2007
Subjects:	Intermetallic compounds Solder and soldering

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