Development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method [electronic resource] /

Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007

Bibliographic Details
Main Authors: 197243 Pang, Hooi San, Fakulti Kejuruteraan Mekanikal
Format:
Language:eng
Published: Skudai : Universiti Teknologi Malaysia, 2007
Subjects: