Development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method [electronic resource] /
Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007
| Main Authors: | , |
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| Format: | |
| Language: | eng |
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Skudai : Universiti Teknologi Malaysia,
2007
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| _version_ | 1826438569629057024 |
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| author | 197243 Pang, Hooi San Fakulti Kejuruteraan Mekanikal |
| author_facet | 197243 Pang, Hooi San Fakulti Kejuruteraan Mekanikal |
| author_sort | 197243 Pang, Hooi San |
| collection | OCEAN |
| description | Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007 |
| first_indexed | 2024-03-05T09:02:14Z |
| format | |
| id | KOHA-OAI-TEST:410872 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T09:02:14Z |
| publishDate | 2007 |
| publisher | Skudai : Universiti Teknologi Malaysia, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:4108722020-12-19T17:14:20ZDevelopment of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method [electronic resource] / 197243 Pang, Hooi San Fakulti Kejuruteraan Mekanikal Skudai : Universiti Teknologi Malaysia,2007engThesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007Includes bibliographical referencesPSZJBLThermal analysisExpansion (Heat) |
| spellingShingle | Thermal analysis Expansion (Heat) 197243 Pang, Hooi San Fakulti Kejuruteraan Mekanikal Development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method [electronic resource] / |
| title | Development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method [electronic resource] / |
| title_full | Development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method [electronic resource] / |
| title_fullStr | Development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method [electronic resource] / |
| title_full_unstemmed | Development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method [electronic resource] / |
| title_short | Development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method [electronic resource] / |
| title_sort | development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method electronic resource |
| topic | Thermal analysis Expansion (Heat) |
| work_keys_str_mv | AT 197243panghooisan developmentoflowcoefficientofthermalexpansioncompositesubstrateforelectronicpackagingusingfiniteelementmethodelectronicresource AT fakultikejuruteraanmekanikal developmentoflowcoefficientofthermalexpansioncompositesubstrateforelectronicpackagingusingfiniteelementmethodelectronicresource |