Development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method [electronic resource] /

Samankaltaisia teoksia

• Development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method /
  Tekijä: 197243 Pang, Hooi San, et al.
  Julkaistu: (2007)
• Development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method
  Tekijä: Pang, Hooi San
  Julkaistu: (2007)
• Analysis of the Thermal Expansion Coefficient of Glass- and Carbon-Fibre-Reinforced Composites
  Tekijä: Romuald Fejkiel, et al.
  Julkaistu: (2024-01-01)
• CALCULATION OF THERMAL EXPANSION COEFFICIENT OF MATERIALS IN THERMAL ELASTOHYDRODYNAMIC LUBRICATION OF LINE CONTACT
  Tekijä: LU ZunYou
  Julkaistu: (2022-01-01)
• Thermal expansion - 1971/
  Tekijä: 480095 Thermal expansion 6, et al.
  Julkaistu: (1972)