Thermal analysis of flip chip ball grid array (FCBGA) electronics package using finite element method [electronic resource] /

Thermal analysis of flip chip ball grid array (FCBGA) electronics package using finite element method [electronic resource] /

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Automotif)) - Universiti Teknologi Malaysia, 2008

Bibliographic Details
Main Author: Nor Haizully Azizan, 1985-
Format:
Published: 2008
Subjects:
Ball grid array technology
Thermal analysis
Flip chip technology
Electronic packaging

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