Skip to content
VuFind
English
Deutsch
Español
Français
Italiano
日本語
Nederlands
Português
Português (Brasil)
中文(简体)
中文（繁體）
Türkçe
עברית
Gaeilge
Cymraeg
Ελληνικά
Català
Euskara
Русский
Čeština
Suomi
Svenska
polski
Dansk
slovenščina
اللغة العربية
বাংলা
Galego
Tiếng Việt
Hrvatski
हिंदी
Հայերէն
Українська
Sámegiella
Монгол
Language
All Fields
Title
Author
Subject
Call Number
ISBN/ISSN
Tag
Find
Advanced
Intermetallic compounds betwee...
Cite this
Text this
Email this
Print
Export Record
Export to RefWorks
Export to EndNoteWeb
Export to EndNote
Permanent link
Intermetallic compounds between Sn-Ag-Cu soldiers and enig surface finish [electronic resource] /
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2008
Bibliographic Details
Main Author:
Noor Afzan Muhamad, 1985-
Format:
Published:
2008
Subjects:
Intermetallic compounds
Solder and soldering
Holdings
Description
Similar Items
Staff View
Similar Items
Intermetallic compounds between Sn-Ag-Cu soldiers and enig surface finish /
by: Noor Afzan Muhamad, 1985-, et al.
Published: (2008)
Effect of multiple reflow and solder bump size solder on intermetallic compound formation between Sn-4Ag-0.5Cu and enig surface finish /
by: 288113 Siti Rabiatull Aisha Idris, et al.
Published: (2006)
Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish /
by: Chin, Ee Mei, 1986-, et al.
Published: (2010)
Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish [electronic resource] /
by: Chin, Ee Mei, 1986-
Published: (2010)
Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish /
by: 458317 Liew, Chung Wah, et al.
Published: (2007)