Intermetallic compound (IMC) formation in lead free soldering on immersion silver finish [electronic resource] /

Intermetallic compound (IMC) formation in lead free soldering on immersion silver finish [electronic resource] /

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal-Bahan)) - Universiti Teknologi Malaysia, 2009

Bibliografski detalji
Glavni autori: 170422 Chua, Chai Ying, Fakulti Kejuruteraan Mekanikal
Format:
Jezik:eng
Izdano: 2009
Teme:
Intermetallic compounds
Solder and soldering

Slični predmeti