Intermetallic compound (IMC) formation in lead free soldering on immersion silver finish [electronic resource] /
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal-Bahan)) - Universiti Teknologi Malaysia, 2009
Main Authors: | 170422 Chua, Chai Ying, Fakulti Kejuruteraan Mekanikal |
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Format: | |
Language: | eng |
Published: |
2009
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Subjects: |
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