Study on the intermetallics formed at the interface between lead free solders and electroless nickel/immersion gold (ENIG) surface finish [compact disc] /
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2005
| Main Author: | |
|---|---|
| Format: | |
| Language: | eng |
| Published: |
Skudai : Universiti Teknologi Malaysia,
2005
|
| Subjects: |