Study on the intermetallics formed at the interface between lead free solders and electroless nickel/immersion gold (ENIG) surface finish [compact disc] /

Study on the intermetallics formed at the interface between lead free solders and electroless nickel/immersion gold (ENIG) surface finish [compact disc] /

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2005

Bibliographic Details
Main Author: 285992 Yeap, Kong Boon
Format:
Language:eng
Published: Skudai : Universiti Teknologi Malaysia, 2005
Subjects:
Nickel-plating
Intermetallic compounds
Description
Summary:Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2005

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