Study on the intermetallics formed at the interface between lead free solders and electroless nickel/immersion gold (ENIG) surface finish [compact disc] /
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2005
| Main Author: | |
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| Format: | |
| Language: | eng |
| Published: |
Skudai : Universiti Teknologi Malaysia,
2005
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| Subjects: |
| _version_ | 1796732831807832064 |
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| author | 285992 Yeap, Kong Boon |
| author_facet | 285992 Yeap, Kong Boon |
| author_sort | 285992 Yeap, Kong Boon |
| collection | OCEAN |
| description | Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2005 |
| first_indexed | 2024-03-05T09:43:43Z |
| format | |
| id | KOHA-OAI-TEST:424676 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T09:43:43Z |
| publishDate | 2005 |
| publisher | Skudai : Universiti Teknologi Malaysia, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:4246762020-12-19T17:14:54ZStudy on the intermetallics formed at the interface between lead free solders and electroless nickel/immersion gold (ENIG) surface finish [compact disc] / 285992 Yeap, Kong Boon Skudai : Universiti Teknologi Malaysia,2005engProject Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 200522PSZJBLNickel-platingIntermetallic compounds |
| spellingShingle | Nickel-plating Intermetallic compounds 285992 Yeap, Kong Boon Study on the intermetallics formed at the interface between lead free solders and electroless nickel/immersion gold (ENIG) surface finish [compact disc] / |
| title | Study on the intermetallics formed at the interface between lead free solders and electroless nickel/immersion gold (ENIG) surface finish [compact disc] / |
| title_full | Study on the intermetallics formed at the interface between lead free solders and electroless nickel/immersion gold (ENIG) surface finish [compact disc] / |
| title_fullStr | Study on the intermetallics formed at the interface between lead free solders and electroless nickel/immersion gold (ENIG) surface finish [compact disc] / |
| title_full_unstemmed | Study on the intermetallics formed at the interface between lead free solders and electroless nickel/immersion gold (ENIG) surface finish [compact disc] / |
| title_short | Study on the intermetallics formed at the interface between lead free solders and electroless nickel/immersion gold (ENIG) surface finish [compact disc] / |
| title_sort | study on the intermetallics formed at the interface between lead free solders and electroless nickel immersion gold enig surface finish compact disc |
| topic | Nickel-plating Intermetallic compounds |
| work_keys_str_mv | AT 285992yeapkongboon studyontheintermetallicsformedattheinterfacebetweenleadfreesoldersandelectrolessnickelimmersiongoldenigsurfacefinishcompactdisc |