Effect of multiple reflow on intermetallic compaund formed between Sn-Ag-Cu lead-free solders and en(P)IG surface finish [electronic resource] /

Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2010

Bibliografski detalji
Glavni autor: Tan, Luyeen, 1986-
Format:
Jezik:eng
Izdano: 2010
Teme: