Effect of multiple reflow on intermetallic compaund formed between Sn-Ag-Cu lead-free solders and en(P)IG surface finish [electronic resource] /
Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2010
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| Format: | |
| Language: | eng |
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2010
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| _version_ | 1826444579366240256 |
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| author | Tan, Luyeen, 1986- |
| author_facet | Tan, Luyeen, 1986- |
| author_sort | Tan, Luyeen, 1986- |
| collection | OCEAN |
| description | Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2010 |
| first_indexed | 2024-03-05T10:30:00Z |
| format | |
| id | KOHA-OAI-TEST:440079 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T10:30:00Z |
| publishDate | 2010 |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:4400792020-12-19T17:15:52ZEffect of multiple reflow on intermetallic compaund formed between Sn-Ag-Cu lead-free solders and en(P)IG surface finish [electronic resource] / Tan, Luyeen, 1986- 2010engProject Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2010Includes bibliographical referencesPSZJBLIntermetallic compoundsSolder and soldering |
| spellingShingle | Intermetallic compounds Solder and soldering Tan, Luyeen, 1986- Effect of multiple reflow on intermetallic compaund formed between Sn-Ag-Cu lead-free solders and en(P)IG surface finish [electronic resource] / |
| title | Effect of multiple reflow on intermetallic compaund formed between Sn-Ag-Cu lead-free solders and en(P)IG surface finish [electronic resource] / |
| title_full | Effect of multiple reflow on intermetallic compaund formed between Sn-Ag-Cu lead-free solders and en(P)IG surface finish [electronic resource] / |
| title_fullStr | Effect of multiple reflow on intermetallic compaund formed between Sn-Ag-Cu lead-free solders and en(P)IG surface finish [electronic resource] / |
| title_full_unstemmed | Effect of multiple reflow on intermetallic compaund formed between Sn-Ag-Cu lead-free solders and en(P)IG surface finish [electronic resource] / |
| title_short | Effect of multiple reflow on intermetallic compaund formed between Sn-Ag-Cu lead-free solders and en(P)IG surface finish [electronic resource] / |
| title_sort | effect of multiple reflow on intermetallic compaund formed between sn ag cu lead free solders and en p ig surface finish electronic resource |
| topic | Intermetallic compounds Solder and soldering |
| work_keys_str_mv | AT tanluyeen1986 effectofmultiplereflowonintermetalliccompaundformedbetweensnagculeadfreesoldersandenpigsurfacefinishelectronicresource |