Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish [electronic resource] /

Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2010

Bibliografski detalji
Glavni autor:	Chin, Ee Mei, 1986-
Format:
Jezik:	eng
Izdano:	2010
Teme:	Intermetallic compounds Solder and soldering

Slični predmeti