Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish [electronic resource] /
Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2010
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| Format: | |
| Language: | eng |
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2010
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| _version_ | 1826444584558788608 |
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| author | Chin, Ee Mei, 1986- |
| author_facet | Chin, Ee Mei, 1986- |
| author_sort | Chin, Ee Mei, 1986- |
| collection | OCEAN |
| description | Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2010 |
| first_indexed | 2024-03-05T10:30:05Z |
| format | |
| id | KOHA-OAI-TEST:440104 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T10:30:05Z |
| publishDate | 2010 |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:4401042020-12-19T17:15:52ZEffect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish [electronic resource] / Chin, Ee Mei, 1986- 2010engProject Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2010Includes bibliographical referencesPSZJBLIntermetallic compoundsSolder and soldering |
| spellingShingle | Intermetallic compounds Solder and soldering Chin, Ee Mei, 1986- Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish [electronic resource] / |
| title | Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish [electronic resource] / |
| title_full | Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish [electronic resource] / |
| title_fullStr | Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish [electronic resource] / |
| title_full_unstemmed | Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish [electronic resource] / |
| title_short | Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish [electronic resource] / |
| title_sort | effect of ni additions on intermetallics formed between sn ag cu solders and en b epig surface finish electronic resource |
| topic | Intermetallic compounds Solder and soldering |
| work_keys_str_mv | AT chineemei1986 effectofniadditionsonintermetallicsformedbetweensnagcusoldersandenbepigsurfacefinishelectronicresource |