Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish [electronic resource] /
Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2010
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Language: | eng |
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2010
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author | Chin, Ee Mei, 1986- |
author_facet | Chin, Ee Mei, 1986- |
author_sort | Chin, Ee Mei, 1986- |
collection | OCEAN |
description | Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2010 |
first_indexed | 2024-03-05T10:30:05Z |
format | |
id | KOHA-OAI-TEST:440104 |
institution | Universiti Teknologi Malaysia - OCEAN |
language | eng |
last_indexed | 2024-03-05T10:30:05Z |
publishDate | 2010 |
record_format | dspace |
spelling | KOHA-OAI-TEST:4401042020-12-19T17:15:52ZEffect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish [electronic resource] / Chin, Ee Mei, 1986- 2010engProject Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2010Includes bibliographical referencesPSZJBLIntermetallic compoundsSolder and soldering |
spellingShingle | Intermetallic compounds Solder and soldering Chin, Ee Mei, 1986- Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish [electronic resource] / |
title | Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish [electronic resource] / |
title_full | Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish [electronic resource] / |
title_fullStr | Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish [electronic resource] / |
title_full_unstemmed | Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish [electronic resource] / |
title_short | Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish [electronic resource] / |
title_sort | effect of ni additions on intermetallics formed between sn ag cu solders and en b epig surface finish electronic resource |
topic | Intermetallic compounds Solder and soldering |
work_keys_str_mv | AT chineemei1986 effectofniadditionsonintermetallicsformedbetweensnagcusoldersandenbepigsurfacefinishelectronicresource |