Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish [electronic resource] /

Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish [electronic resource] /

Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2010

Bibliographic Details
Main Author:	Chin, Ee Mei, 1986-
Format:
Language:	eng
Published:	2010
Subjects:	Intermetallic compounds Solder and soldering

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