Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish [electronic resource] /
Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2010
Main Author: | Chin, Ee Mei, 1986- |
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Format: | |
Language: | eng |
Published: |
2010
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Subjects: |
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