Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish [electronic resource] /

Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2010

Bibliographic Details
Main Author: Chin, Ee Mei, 1986-
Format:
Language:eng
Published: 2010
Subjects:

Similar Items