Adhesion on different rate of binder and aggregate for chip seal [electronic resource] /

Adhesion on different rate of binder and aggregate for chip seal [electronic resource] /

Thesis (Sarjana Kejuruteraan (Awam - Pengangkutan dan Jalanraya)) - Universiti Teknologi Malaysia, 2010

Bibliographic Details
Main Authors: 346004 Nor Ikhwan Khalid, Fakulti Kejuruteraan Awam
Format:
Language:eng
Published: 2010
Subjects:
Roads
Surface sealers

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