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Numerical modeling of the tran...
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Numerical modeling of the transient liquid phase bonding process of Ni using Ni-B-Cr ternary filler metal/
PSZJBL
Bibliographic Details
Main Authors:
496048 Ohsasa, K.
,
Shinmura, T.
,
Narita, T.
Format:
Language:
eng
Subjects:
Filler metal
Diffusion bonding (Metals)
Holdings
Description
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