Numerical modeling of the transient liquid phase bonding process of Ni using Ni-B-Cr ternary filler metal/

PSZJBL

Bibliographic Details
Main Authors: 496048 Ohsasa, K., Shinmura, T., Narita, T.
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Language:eng
Subjects:
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author 496048 Ohsasa, K.
Shinmura, T.
Narita, T.
author_facet 496048 Ohsasa, K.
Shinmura, T.
Narita, T.
author_sort 496048 Ohsasa, K.
collection OCEAN
description PSZJBL
first_indexed 2024-03-05T10:39:38Z
format
id KOHA-OAI-TEST:443277
institution Universiti Teknologi Malaysia - OCEAN
language eng
last_indexed 2024-03-05T10:39:38Z
record_format dspace
spelling KOHA-OAI-TEST:4432772020-12-19T17:16:02ZNumerical modeling of the transient liquid phase bonding process of Ni using Ni-B-Cr ternary filler metal/ 496048 Ohsasa, K. Shinmura, T. Narita, T. engPSZJBLFiller metalDiffusion bonding (Metals)
spellingShingle Filler metal
Diffusion bonding (Metals)
496048 Ohsasa, K.
Shinmura, T.
Narita, T.
Numerical modeling of the transient liquid phase bonding process of Ni using Ni-B-Cr ternary filler metal/
title Numerical modeling of the transient liquid phase bonding process of Ni using Ni-B-Cr ternary filler metal/
title_full Numerical modeling of the transient liquid phase bonding process of Ni using Ni-B-Cr ternary filler metal/
title_fullStr Numerical modeling of the transient liquid phase bonding process of Ni using Ni-B-Cr ternary filler metal/
title_full_unstemmed Numerical modeling of the transient liquid phase bonding process of Ni using Ni-B-Cr ternary filler metal/
title_short Numerical modeling of the transient liquid phase bonding process of Ni using Ni-B-Cr ternary filler metal/
title_sort numerical modeling of the transient liquid phase bonding process of ni using ni b cr ternary filler metal
topic Filler metal
Diffusion bonding (Metals)
work_keys_str_mv AT 496048ohsasak numericalmodelingofthetransientliquidphasebondingprocessofniusingnibcrternaryfillermetal
AT shinmurat numericalmodelingofthetransientliquidphasebondingprocessofniusingnibcrternaryfillermetal
AT naritat numericalmodelingofthetransientliquidphasebondingprocessofniusingnibcrternaryfillermetal