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Ball attach yield improvement-...
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Ball attach yield improvement-DMAIC approach /
Thesis (Sarjana Kejuruteraan (Kejuruteraan Industri)) - Universiti Teknologi Malaysia, 2011
Bibliographic Details
Main Authors:
Mutukumaar Nallappan, 1984-
,
Wong, Kuan Yew, supervisor
,
Fakulti Kejuruteraan Mekanikal
Format:
Language:
eng
Published:
2011
Subjects:
Solder and soldering
Welded joints
Holdings
Description
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