Bond stress of grout-filled splice sleeve integrated with transverse bar under incremental tensile load /

Bond stress of grout-filled splice sleeve integrated with transverse bar under incremental tensile load /

Project Paper (Sarjana Muda Kejuruteraan (Awam - Struktur dan Bahan)) - Universiti Teknologi Malaysia, 2011

Bibliographic Details
Main Authors: Foo, Zhi Sien, 1987- , author, Ahmad Baharuddin Abd. Rahman, supervisor, Fakulti Kejuruteraan Awam
Format:
Language:eng
Published: 2011
Subjects:
Grouting

Similar Items