Skip to content
VuFind
English
Deutsch
Español
Français
Italiano
日本語
Nederlands
Português
Português (Brasil)
中文(简体)
中文(繁體)
Türkçe
עברית
Gaeilge
Cymraeg
Ελληνικά
Català
Euskara
Русский
Čeština
Suomi
Svenska
polski
Dansk
slovenščina
اللغة العربية
বাংলা
Galego
Tiếng Việt
Hrvatski
हिंदी
Հայերէն
Українська
Sámegiella
Монгол
Language
All Fields
Title
Author
Subject
Call Number
ISBN/ISSN
Tag
Find
Advanced
Adhesion of fourteen milimeter...
Cite this
Text this
Email this
Print
Export Record
Export to RefWorks
Export to EndNoteWeb
Export to EndNote
Permanent link
Adhesion of fourteen milimeters chip seal at different aggregate and binder rates /
Project Paper (Sarjana Muda Kejuruteraan (Awam)) - Universiti Teknologi Malaysia, 2011
Bibliographic Details
Main Authors:
Nurhaziyah Mahdan, 1988-, author
,
Haryati Yaacob, supervisor
,
Fakulti Kejuruteraan Awam
Format:
Language:
d
Published:
2011
Subjects:
Adhesion
Holdings
Description
Similar Items
Staff View
Similar Items
Adhesion of fourteen milimeters chip seal at different aggregate and binder rates [electronic resource] /
by: Nurhaziyah Mahdan, 1988-, author
Published: (2011)
Adhesion of 6mm chip seal at different binder rate and aggregate rate /
by: Wong, Tat Hong, 1987-, author, et al.
Published: (2011)
Adhesion of 10mm chip seal at different binder rate and aggregate rate /
by: Tea, Siang Teck, 1987-, author, et al.
Published: (2011)
Adhesion of 6mm coated aggregate for chip seal application /
by: Murni Mahadi, 1988-, author, et al.
Published: (2011)
Adhesion of 6mm chip seal at different binder rate and aggregate rate [electronic resource] /
by: Wong, Tat Hong, 1987-, author
Published: (2011)