Quality improvement of the wire bonding process in a semi conductor company [electronic resource] /

Quality improvement of the wire bonding process in a semi conductor company [electronic resource] /

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Industri)) - Universiti Teknologi Malaysia, 2011

Detalhes bibliográficos
Principais autores: Ng, Wei Kuo, 1987-, Wong, Kuan Yew, supervisor, Fakulti Kejuruteraan Mekanikal
Formato:
Idioma:eng
Publicado em: 2011
Assuntos:
Total quality management

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