Effect of nickle doping in Sn-Ag-Cu solders on intermetallics formed during soldering on direct immersion gold (DIG) surface finish /

Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2011

Bibliographic Details
Main Authors: Ng, Theng Pin, 1987-, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal
Format:
Language:eng
Published: 2011
Subjects: