Effect of nickle doping in Sn-Ag-Cu solders on intermetallics formed during soldering on direct immersion gold (DIG) surface finish /

Míreanna comhchosúla

• Effect of nickle doping in Sn-Ag-Cu solders on intermetallics formed during soldering on direct immersion gold (DIG) surface finish [electronic resource] /
  de réir: Ng, Theng Pin, 1987-, et al.
  Foilsithe / Cruthaithe: (2011)
• Formation of intermetallic compound between Sn-Ag-Cu solders and direct immersion gold (DIG) surface finish /
  de réir: Chia, Xing Nian, 1987-, et al.
  Foilsithe / Cruthaithe: (2011)
• Formation of intermetallic compound between Sn-Ag-Cu solders and direct immersion gold (DIG) surface finish [electronic resource] /
  de réir: Chia, Xing Nian, 1987-, et al.
  Foilsithe / Cruthaithe: (2011)
• Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish /
  de réir: 458317 Liew, Chung Wah, et al.
  Foilsithe / Cruthaithe: (2007)
• Intermetallics formed between Sn-Ag-Cu solders and electroless nickel/ electroless palladium/ immersion gold surface finish /
  de réir: Lock, Poh Choo, 1987-, et al.
  Foilsithe / Cruthaithe: (2010)