Effect of nickle doping in Sn-Ag-Cu solders on intermetallics formed during soldering on direct immersion gold (DIG) surface finish /
Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2011
| Үндсэн зохиолчид: | , , |
|---|---|
| Формат: | |
| Хэл сонгох: | eng |
| Хэвлэсэн: |
2011
|
| Нөхцлүүд: |