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Effect of nickle doping in Sn-Ag-Cu solders on intermetallics formed during soldering on direct immersion gold (DIG) surface finish /
Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2011
书目详细资料
Main Authors:
Ng, Theng Pin, 1987-
,
Ali Ourdjini
,
Fakulti Kejuruteraan Mekanikal
格式:
语言:
eng
出版:
2011
主题:
Gold
持有资料
实物特征
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