Effect of bismuth doping on intermetallic compound between Sn-Ag-Cu and Sn-Ag solders on electroless nickel (phosphorus)/immersion gold surface finish [electronic resources] /
Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2012
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| Language: | eng |
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2012
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