Effect of bismuth doping on intermetallic compound between Sn-Ag-Cu and Sn-Ag solders on electroless nickel (phosphorus)/immersion gold surface finish [electronic resources] /

Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2012

Xehetasun bibliografikoak
Egile Nagusiak: Chong, Phey Shan, 1988-, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal
Formatua:
Hizkuntza:eng
Argitaratua: 2012
Gaiak:
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author Chong, Phey Shan, 1988-
Ali Ourdjini
Fakulti Kejuruteraan Mekanikal
author_facet Chong, Phey Shan, 1988-
Ali Ourdjini
Fakulti Kejuruteraan Mekanikal
author_sort Chong, Phey Shan, 1988-
collection OCEAN
description Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2012
first_indexed 2024-03-05T12:16:50Z
format
id KOHA-OAI-TEST:475664
institution Universiti Teknologi Malaysia - OCEAN
language eng
last_indexed 2024-03-05T12:16:50Z
publishDate 2012
record_format dspace
spelling KOHA-OAI-TEST:4756642020-12-19T17:17:32ZEffect of bismuth doping on intermetallic compound between Sn-Ag-Cu and Sn-Ag solders on electroless nickel (phosphorus)/immersion gold surface finish [electronic resources] / Chong, Phey Shan, 1988- Ali Ourdjini Fakulti Kejuruteraan Mekanikal 2012engProject Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2012Includes bibliographical referencesPSZJBLBismuth
spellingShingle Bismuth
Chong, Phey Shan, 1988-
Ali Ourdjini
Fakulti Kejuruteraan Mekanikal
Effect of bismuth doping on intermetallic compound between Sn-Ag-Cu and Sn-Ag solders on electroless nickel (phosphorus)/immersion gold surface finish [electronic resources] /
title Effect of bismuth doping on intermetallic compound between Sn-Ag-Cu and Sn-Ag solders on electroless nickel (phosphorus)/immersion gold surface finish [electronic resources] /
title_full Effect of bismuth doping on intermetallic compound between Sn-Ag-Cu and Sn-Ag solders on electroless nickel (phosphorus)/immersion gold surface finish [electronic resources] /
title_fullStr Effect of bismuth doping on intermetallic compound between Sn-Ag-Cu and Sn-Ag solders on electroless nickel (phosphorus)/immersion gold surface finish [electronic resources] /
title_full_unstemmed Effect of bismuth doping on intermetallic compound between Sn-Ag-Cu and Sn-Ag solders on electroless nickel (phosphorus)/immersion gold surface finish [electronic resources] /
title_short Effect of bismuth doping on intermetallic compound between Sn-Ag-Cu and Sn-Ag solders on electroless nickel (phosphorus)/immersion gold surface finish [electronic resources] /
title_sort effect of bismuth doping on intermetallic compound between sn ag cu and sn ag solders on electroless nickel phosphorus immersion gold surface finish electronic resources
topic Bismuth
work_keys_str_mv AT chongpheyshan1988 effectofbismuthdopingonintermetalliccompoundbetweensnagcuandsnagsoldersonelectrolessnickelphosphorusimmersiongoldsurfacefinishelectronicresources
AT aliourdjini effectofbismuthdopingonintermetalliccompoundbetweensnagcuandsnagsoldersonelectrolessnickelphosphorusimmersiongoldsurfacefinishelectronicresources
AT fakultikejuruteraanmekanikal effectofbismuthdopingonintermetalliccompoundbetweensnagcuandsnagsoldersonelectrolessnickelphosphorusimmersiongoldsurfacefinishelectronicresources