Effect of bismuth doping on intermetallic compound between Sn-Ag-Cu and Sn-Ag solders on electroless nickel (phosphorus)/immersion gold surface finish [electronic resources] /
Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2012
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| Format: | |
| Language: | eng |
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2012
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| _version_ | 1826451966273781760 |
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| author | Chong, Phey Shan, 1988- Ali Ourdjini Fakulti Kejuruteraan Mekanikal |
| author_facet | Chong, Phey Shan, 1988- Ali Ourdjini Fakulti Kejuruteraan Mekanikal |
| author_sort | Chong, Phey Shan, 1988- |
| collection | OCEAN |
| description | Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2012 |
| first_indexed | 2024-03-05T12:16:50Z |
| format | |
| id | KOHA-OAI-TEST:475664 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T12:16:50Z |
| publishDate | 2012 |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:4756642020-12-19T17:17:32ZEffect of bismuth doping on intermetallic compound between Sn-Ag-Cu and Sn-Ag solders on electroless nickel (phosphorus)/immersion gold surface finish [electronic resources] / Chong, Phey Shan, 1988- Ali Ourdjini Fakulti Kejuruteraan Mekanikal 2012engProject Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2012Includes bibliographical referencesPSZJBLBismuth |
| spellingShingle | Bismuth Chong, Phey Shan, 1988- Ali Ourdjini Fakulti Kejuruteraan Mekanikal Effect of bismuth doping on intermetallic compound between Sn-Ag-Cu and Sn-Ag solders on electroless nickel (phosphorus)/immersion gold surface finish [electronic resources] / |
| title | Effect of bismuth doping on intermetallic compound between Sn-Ag-Cu and Sn-Ag solders on electroless nickel (phosphorus)/immersion gold surface finish [electronic resources] / |
| title_full | Effect of bismuth doping on intermetallic compound between Sn-Ag-Cu and Sn-Ag solders on electroless nickel (phosphorus)/immersion gold surface finish [electronic resources] / |
| title_fullStr | Effect of bismuth doping on intermetallic compound between Sn-Ag-Cu and Sn-Ag solders on electroless nickel (phosphorus)/immersion gold surface finish [electronic resources] / |
| title_full_unstemmed | Effect of bismuth doping on intermetallic compound between Sn-Ag-Cu and Sn-Ag solders on electroless nickel (phosphorus)/immersion gold surface finish [electronic resources] / |
| title_short | Effect of bismuth doping on intermetallic compound between Sn-Ag-Cu and Sn-Ag solders on electroless nickel (phosphorus)/immersion gold surface finish [electronic resources] / |
| title_sort | effect of bismuth doping on intermetallic compound between sn ag cu and sn ag solders on electroless nickel phosphorus immersion gold surface finish electronic resources |
| topic | Bismuth |
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