Effect of bismuth doping on intermetallic compound between Sn-Ag-Cu and Sn-Ag solders on electroless nickel (phosphorus)/immersion gold surface finish [electronic resources] /

Effect of bismuth doping on intermetallic compound between Sn-Ag-Cu and Sn-Ag solders on electroless nickel (phosphorus)/immersion gold surface finish [electronic resources] /

Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2012

Bibliographic Details
Main Authors:	Chong, Phey Shan, 1988-, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal
Format:
Language:	eng
Published:	2012
Subjects:	Bismuth

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