Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model /

Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model /

Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2012

Bibliographic Details
Main Authors: Aliff Farhan Mohd. Yamin, 1986-, Mohd. Nasir Tamin, supervisor, Fakulti Kejuruteraan Mekanikal
Format:
Language:eng
Published: 2012
Subjects:
Electronic apparatus and appliances
Joints (Engineering)
Solder and soldering

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