Effects of chemical mechanical polishing (CMP) parameters on NIP/AL substrate surface characteristics [electronic resource] /

Thesis (Sarjana Kejuruteraan (Kejuruteraan Industri)) - Universiti Teknologi Malaysia, 2014

Bibliographic Details
Main Author:	Mohd. Aidil Rosli, 1985-
Format:
Language:	eng
Published:	2014
Subjects:	Grinding and polishing Chemical mechanical planarization

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