Effects of chemical mechanical polishing (CMP) parameters on NIP/AL substrate surface characteristics [electronic resource] /
Thesis (Sarjana Kejuruteraan (Kejuruteraan Industri)) - Universiti Teknologi Malaysia, 2014
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| Language: | eng |
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2014
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| _version_ | 1796750047196479488 |
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| author | Mohd. Aidil Rosli, 1985- |
| author_facet | Mohd. Aidil Rosli, 1985- |
| author_sort | Mohd. Aidil Rosli, 1985- |
| collection | OCEAN |
| description | Thesis (Sarjana Kejuruteraan (Kejuruteraan Industri)) - Universiti Teknologi Malaysia, 2014 |
| first_indexed | 2024-03-05T13:45:54Z |
| format | |
| id | KOHA-OAI-TEST:505247 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T13:45:54Z |
| publishDate | 2014 |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:5052472020-12-19T17:18:42ZEffects of chemical mechanical polishing (CMP) parameters on NIP/AL substrate surface characteristics [electronic resource] / Mohd. Aidil Rosli, 1985- 2014engThesis (Sarjana Kejuruteraan (Kejuruteraan Industri)) - Universiti Teknologi Malaysia, 2014Includes bibliographical referencesPSZJBLGrinding and polishingChemical mechanical planarization |
| spellingShingle | Grinding and polishing Chemical mechanical planarization Mohd. Aidil Rosli, 1985- Effects of chemical mechanical polishing (CMP) parameters on NIP/AL substrate surface characteristics [electronic resource] / |
| title | Effects of chemical mechanical polishing (CMP) parameters on NIP/AL substrate surface characteristics [electronic resource] / |
| title_full | Effects of chemical mechanical polishing (CMP) parameters on NIP/AL substrate surface characteristics [electronic resource] / |
| title_fullStr | Effects of chemical mechanical polishing (CMP) parameters on NIP/AL substrate surface characteristics [electronic resource] / |
| title_full_unstemmed | Effects of chemical mechanical polishing (CMP) parameters on NIP/AL substrate surface characteristics [electronic resource] / |
| title_short | Effects of chemical mechanical polishing (CMP) parameters on NIP/AL substrate surface characteristics [electronic resource] / |
| title_sort | effects of chemical mechanical polishing cmp parameters on nip al substrate surface characteristics electronic resource |
| topic | Grinding and polishing Chemical mechanical planarization |
| work_keys_str_mv | AT mohdaidilrosli1985 effectsofchemicalmechanicalpolishingcmpparametersonnipalsubstratesurfacecharacteristicselectronicresource |